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Research Progress on Modified Dicyandiamide Cured Epoxy Resins

November 27, 2024
As one of the earliest latent curing agents, dicyandiamide endows the cured epoxy resin with excellent mechanical properties. However, it still has drawbacks such as a relatively high curing temperature. In view of this defect, this paper summarizes the domestic and foreign literature from two aspects: reducing the electron-withdrawing ability of the cyano group on dicyandiamide to enhance the curing activity and introducing similar groups to improve the compatibility between dicyandiamide and epoxy resin. Moreover, the application prospects of the epoxy resin cured by modified dicyandiamide are also presented.
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